The semiconductor industry stands at the heart of technological innovation, driving advancements in AI, 5G, electric vehicles, and beyond. To meet the ever-growing global demand for chips, the construction of semiconductor fabs has become a critical priority. These state-of-the-art facilities require precision design, advanced engineering, and the integration of cutting-edge technologies to enable the production of increasingly complex chips. However, the challenges of fab construction demand collaborative approaches and solutions, from managing supply chain disruptions to achieving energy efficiency and environmental compliance.

With the U.S. semiconductor sector undergoing a historic resurgence, driven by the CHIPS Act and federal investments, the time is ripe for industry leaders, engineers, and policymakers to converge and share expertise. Hence, we are organizing “Semiconductor Fab Construction: Advances in Design and Engineering” this year on June 11-12 in Austin, Texas, U.S. to explore the latest innovations in fab design, modular construction, cleanroom validation and humidity control, and sustainability, providing actionable insights to accelerate projects and reduce costs. By gathering together global thought leaders in Austin, TX, a city known for its tech ecosystem, we aim to enhance collaboration, drive innovation, and strengthen the semiconductor supply chain at a critical juncture for the industry. This conference will equip participants with the knowledge and connections to advance their projects and ensure that the U.S. remains a competitive leader in semiconductor manufacturing.

Let’s take the next step in building the fabs smarter, faster, and greener for the future.